The machining accuracy can reach IT5～IT1, and the surface roughness can reach Ra0.63～0.01 micron.

For third-generation semiconductor materials, represented by silicon carbide and gallium nitride, a complete set of products and overall solutions can be provided, including silicon ingot cutting (electroplating band saw), cylindrical/flat grinding silicon rod silicon ingot (diamond wire) grinding (double-sided wheel/polishing pad), edge grinding, surface grinding, polishing, wafer back thinning (ceramic/resin wheel), cutting (cutting blade), etc.